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Elaboration by electroless and characterization of Ni-Sn-P alloy | Abstract

Der Pharma Chemica
Journal for Medicinal Chemistry, Pharmaceutical Chemistry, Pharmaceutical Sciences and Computational Chemistry

ISSN: 0975-413X
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Abstract

Elaboration by electroless and characterization of Ni-Sn-P alloy

Author(s): H. El Grini, A. Machrouhi, S. Cherrouf and M. Cherkaoui

The aim of this study is to develop a Ni-Sn-P coating by electroless. The plating bath was formulated with tin chloride and nickel sulfate as a source of metal ions, sodium hypophosphite as a reducing agent and tri-sodium citrate as complexing. This electrolyte is stable over time and the resulting coating is adherent and uniform. The tin content is about 14.5%. The deposition rate calculated by gravimetry is 2μm/h substantially lower than that obtained in the chemical nickel plating baths. This result was confirmed by cyclic voltammetry and electrochemical impedance measurements. The addition of the stannous ions in the bath results in some change in the shape of voltammograms compared to those obtained in the electroless nickel bath. The peak corresponding to the oxidation of the coating crystalline phase has disappeared suggesting that the deposit Ni-Sn-P would be substantially amorphous in contrast to deposit Ni-P which is biphasic.


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